This study presents the development and optimization of an electrochemical additive manufacturing technique for the fabrication of copper parts with various geometries, including dots, lines, and complex shapes, on metallic substrates. A customized syringe-based printing system was designed to enable precise, localized electrochemical additive manufacturing. The influences of key process parameters, including deposition voltage, nozzle feed rate, nozzle-to-substrate distance, and inter-electrode gap, on the deposition rate, surface morphology, and microstructure of the copper parts were systematically investigated. The results indicate that increasing the deposition voltage accelerates the growth rate but compromises surface smoothness and crystalline refinement. Optimal printing deposition was achieved at an applied voltage of 3 V, a nozzle feed rate of 0.4 mm/s, a nozzle-to-substrate distance of 0.1 mm, and the electrode spacing of 0.3 mm, yielding dense and uniform copper structures, as confirmed by optical microscopy and surface profilometry. The study highlights how variations in process parameters influence the deposition speed, surface quality, and microstructure of copper parts, establishing an optimal range for process settings. These findings offer significant guidance for achieving high-performance metal additive manufacturing in the future.